Elbit Systems:Defense industry, founded in 1966, headquarters in Haifa Israel, subsidiaries in
numerous countries.
Publicly traded in NASDAQ and TASE, over 4.5B$ in 2019.
Around 16,500 employees, most of them engineers. In Israel – 12,000 employees and more
than 7,000 subcontractors in dozens of R&D and manufacturing sites.
Main business areas: solutions for air and space, land, naval. Unmanned vehicles, cyber
systems, homeland security and commercial products and systems.
Investing approximately 8%* of revenues in R&D. Incubating deep-tech start-ups and
collaborating with commercial technology entrepreneurs.
Leveraging technology assets to develop commercial applications. Maintaining an extensive
range of R&D collaborations with academic institutions and international research bodies 

Elbit Systems aerospace division develops various airborne systems for military and civilian
markets. Various technological systems, from : helmet mount systems for pilots, through a
variety of advanced observation systems, smart display systems, guided armament,
simulation systems and systems for improving flight safety. Those  systems are based on
electronic systems that gives a variety of unique technologies capabilities and improves their
competitiveness in the world.
One of the technological limitations that exists today in the electronic systems related to the
partial operation power because the temperature that develops on the component is too
high and lowers its functionality and reliability.
Development of lightweight and small-volume products while increasing the power
consumption by improving the thermal performance without adding weight and volume to
the product will lead to technological uniqueness and contribute to development of
advanced technologies and products with higher reliability, greater density of components
and hence reducing their size and weight.
As part of the MAAGAD activities, Eblit leads the thermal group that develop technologies of
combining graphene in printed circuits to improve heat dissipation capabilities of printed
circuits by combining graphene sheets and / or graphene-boron-nitride particles in the
integrated elements insode the printed circuit and on external elements on the printed
circuit to improve its thermal performance.